MATERIAL PROPERTIES
|
Material Properties for Alumina Ceramics |
|
Properties / Method |
Unit |
PEC94 |
PEC96 |
PEC995 |
PEC998 |
|
Composition |
Weight % |
94% Al2O3 |
96% Al2O3 |
99.5% Al2O3 |
99.8% Al2O3 |
|
Process |
-- |
Sintered |
Sintered |
Sintered |
Sintered |
|
Color |
-- |
White |
White |
White |
Ivory |
|
Density |
g/cm3 |
3.69 |
3.71 |
3.90 |
3.92 |
|
Flexural Strength / MOR |
MPa |
364 |
372 |
388 |
395 |
|
Fracture Toughness, K(IC) / Notched
Beam |
MPa
m1/2 |
4 |
4 |
5 |
5 |
|
Hardness /
Knoop
1000g |
Kg/mm2 |
1200 |
1200 |
1450 |
1500 |
|
Young’s Modulus |
GPa |
305 |
305 |
380 |
380 |
|
Poisson’s Ratio |
-- |
0.21 |
0.21 |
0.22 |
0.22 |
|
Average Grain Size |
Microns,
m |
10 |
6 |
5 |
4 |
|
Max Use Temperature |
Degrees °C |
1725 |
1725 |
1725 |
1725 |
|
Thermal Shock Resistance,
DT
|
°C |
300 |
300 |
250 |
250 |
|
Gas Permeability |
atm-cc/sec |
None |
None |
None |
None |
|
Dielectric Constant |
1 MHz, 25 °C |
9.1 |
9.2 |
9.8 |
10.5 |
|
Thermal Expansion Coefficient (25-1000
oC) |
/°C
|
7.8 x 10-6 |
7.8 x 10-6 |
8.0 x 10-6 |
8.0 x 10-6 |
|
Thermal
Conductivity |
W/m·°K,
20°C |
22.5 |
24.9 |
29.0 |
30.0 |
|
|
Material Properties for
Zirconia, Silicon Nitride, & EDM-Machinable Ceramics |
|
Properties /
Method |
Unit |
TZ-30D |
TZ-30M |
SSN-310 |
PEC EDM |
|
Composition |
Weight % |
YTZP
Zirconia
High Strength |
Mg-PSZ
Zirconia |
Silicon Nitride |
EDM
Machinable
|
|
Process |
-- |
Sintered & HIPPED* |
Sintered/ Toughened |
Sinter- Reaction Bonded |
Hot Pressed |
|
Color |
-- |
Varies (Gray-Green) |
Ivory |
Black |
Black |
|
Density |
g/cm3 |
6.05 |
5.83 |
3.20 |
3.90 |
|
Flexural Strength /
Four Point Bending |
MPa |
1400 |
650 |
800 |
690 |
|
Compressive Strength /
ASTM-C773 |
MPa,
25 °C |
2500 |
1750 |
-- |
-- |
|
Fracture Toughness, K(IC) /
SENB Notched Beam |
MPa
m1/2 |
8 |
10 |
5.8 |
9.6 |
|
Young’s Modulus /
Pulse-Echo Method |
GPa |
220 |
200 |
310 |
406 |
|
Average
Grain Size |
Microns, m |
< 1 |
20 |
-- |
< 3 |
|
Max Use
Temperature
Recommended
Use Temp |
Degrees °C
Degrees °C |
1500
< 280
|
1500
< 1150
|
1600
up to 1600
|
1600
up to 1600
|
|
Thermal Shock
Resistance,
DT
|
°C |
400 |
400 |
500 |
-- |
|
Hardness /
Knoop
1000 g |
Kg/mm2 |
1300 |
1200 |
1800 |
2400 |
|
Dielectric
Constant
|
1 MHz, 25 °C |
28 |
27 |
9 |
-- |
|
Electrical
Resistivity |
Ohm-cm |
1013 |
1013 |
1014 |
9 x 10-3 |
|
Thermal Expansion
Coefficient (25-1000 oC) |
/°C
|
10.3 x 10-6 |
10.1 x 10-6 |
3.1 x 10-6 |
7.0 x 10-6 |
|
Thermal
Conductivity
|
W/m·°K,
25°C |
2.2 |
2.2 |
26 |
63 |
|
PEC Rev 4. /2003
Note:
The information specified in this data sheet is for
design
guidance only. Forming methods and specific geometry
will affect exact values. ASTM methods were followed
for all test. |
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