MATERIAL PROPERTIES
 
Material Properties for Alumina Ceramics

Properties / Method

Unit

PEC94

PEC96

PEC995

PEC998

Composition

Weight %

94% Al2O3

96% Al2O3

99.5% Al2O3

99.8% Al2O3

Process

--

Sintered

Sintered

Sintered

Sintered

Color

--

White

White

White

Ivory

Density

g/cm3

3.69

3.71

3.90

3.92

Flexural Strength / MOR

MPa

364

372

388

395

Fracture Toughness, K(IC) / Notched Beam

MPa m1/2

4

4

5

5

Hardness / Knoop 1000g

Kg/mm2

1200

1200

1450

1500

Young’s Modulus

GPa

305

305

380

380

Poisson’s Ratio

--

0.21

0.21

0.22

0.22

Average Grain Size

Microns, m

10

6

5

4

Max Use Temperature

Degrees °C

1725

1725

1725

1725

Thermal Shock Resistance, D

°C

300

300

250

250

Gas Permeability

atm-cc/sec

None

None

None

None

Dielectric Constant

1 MHz, 25 °C

9.1

9.2

9.8

10.5

Thermal Expansion Coefficient (25-1000 oC)

/°C

7.8 x 10-6

7.8 x 10-6

8.0 x 10-6

8.0 x 10-6

Thermal Conductivity

W/m·°K, 20°C

22.5

24.9

29.0

30.0

 

Material Properties for Zirconia, Silicon Nitride, & EDM-Machinable Ceramics

Properties / Method

Unit

TZ-30D

TZ-30M

SSN-310

PEC EDM

Composition

Weight %

YTZP Zirconia High Strength

Mg-PSZ Zirconia

Silicon Nitride

EDM Machinable

Process

--

Sintered & HIPPED*

Sintered/ Toughened

Sinter- Reaction Bonded

Hot Pressed

Color

--

Varies (Gray-Green)

Ivory

Black

Black

Density

g/cm3

6.05

5.83

3.20

3.90

Flexural Strength / Four Point Bending

MPa

1400 650  800  690

Compressive Strength / ASTM-C773

MPa, 25 °C

2500

1750

--

--

Fracture Toughness, K(IC) / SENB Notched Beam

MPa m1/2

8

10

5.8

9.6

Young’s Modulus / Pulse-Echo Method

GPa

220

200

310

 406

Average Grain Size

Microns, m

< 1

20

--

< 3

Max Use Temperature

Recommended Use Temp

Degrees °C

Degrees °C

1500
    

< 280
    

1500
    

< 1150
    

1600
    

up to 1600
    

1600
    

up to 1600
    

Thermal Shock Resistance, DT 

°C

400

400

500

--

Hardness  / Knoop 1000 g

Kg/mm2

1300

1200

1800

2400

Dielectric Constant

1 MHz, 25 °C

28

27

 9

 --

Electrical Resistivity

Ohm-cm

1013

1013

1014

9 x 10-3

Thermal Expansion Coefficient (25-1000 oC)

/°C

10.3 x 10-6

10.1 x 10-6

3.1 x 10-6

7.0 x 10-6

Thermal Conductivity

W/m·°K, 25°C

2.2

2.2

26

63

                                                                         PEC Rev 4. /2003

Note:
          The information specified in this data sheet is for design
          guidance only.  Forming methods and specific geometry
          will affect exact values.  ASTM methods were followed
          for all test.